Electrodeposition, characterization and morphological investigations of NiFe/Cu multilayers prepared by pulsed galvanostatic, dual bath technique
Abstract
NiFe/Cu multilayers were grown sequentially by pulsed electrodeposition on copper (Cu) substrates. The layers were prepared in galvanostatic mode using a dual bath technique. The morphology, thickness, roughness and composition of the layers were studied using scanning electron microscopy, scanning transmission electron microscopy with energy dispersive X-ray spectroscopy, X-ray diffraction and atomic force microscopy. Analysis showed that the resulting multilayers were continuous layers with a root mean square roughness of 30 nm and a grain size of 20-60 nm. The Cu substrate and the electrodeposited Cu layer were preferentially (200) oriented while the NiFe layers were polycrystalline but with a preferred (200) texture. The thinnest multilayers produced were 20/40, NiFe/Cu, respectively. - Research Highlights: {yields} Thin MLs of Cu and Py can be ED utilizing a pulsed-galvanostatic, DBT. {yields} The resulting multilayers were continuous layers with an rms of 30 nm. {yields} The smallest average thickness achieved by DBT was 40 nm/20 nm for Cu/NiFe.
- Authors:
-
- Department of Material Science and Engineering, Shiraz University, Shiraz (Iran, Islamic Republic of)
- Department of Physics, Simon Fraser University, Burnaby, British Colombia (Canada)
- Publication Date:
- OSTI Identifier:
- 22063663
- Resource Type:
- Journal Article
- Journal Name:
- Materials Characterization
- Additional Journal Information:
- Journal Volume: 62; Journal Issue: 2; Other Information: Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 1044-5803
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY; ATOMIC FORCE MICROSCOPY; COPPER; ELECTRODEPOSITION; GRAIN SIZE; INTERMETALLIC COMPOUNDS; IRON; LAYERS; MORPHOLOGY; NANOSTRUCTURES; NICKEL; POLYCRYSTALS; ROUGHNESS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; SURFACES; TEXTURE; THICKNESS; TRANSMISSION ELECTRON MICROSCOPY; X-RAY DIFFRACTION; X-RAY SPECTROSCOPY
Citation Formats
Esmaili, S, Bahrololoom, M E, and Kavanagh, K L. Electrodeposition, characterization and morphological investigations of NiFe/Cu multilayers prepared by pulsed galvanostatic, dual bath technique. United States: N. p., 2011.
Web. doi:10.1016/J.MATCHAR.2010.11.017.
Esmaili, S, Bahrololoom, M E, & Kavanagh, K L. Electrodeposition, characterization and morphological investigations of NiFe/Cu multilayers prepared by pulsed galvanostatic, dual bath technique. United States. https://doi.org/10.1016/J.MATCHAR.2010.11.017
Esmaili, S, Bahrololoom, M E, and Kavanagh, K L. 2011.
"Electrodeposition, characterization and morphological investigations of NiFe/Cu multilayers prepared by pulsed galvanostatic, dual bath technique". United States. https://doi.org/10.1016/J.MATCHAR.2010.11.017.
@article{osti_22063663,
title = {Electrodeposition, characterization and morphological investigations of NiFe/Cu multilayers prepared by pulsed galvanostatic, dual bath technique},
author = {Esmaili, S and Bahrololoom, M E and Kavanagh, K L},
abstractNote = {NiFe/Cu multilayers were grown sequentially by pulsed electrodeposition on copper (Cu) substrates. The layers were prepared in galvanostatic mode using a dual bath technique. The morphology, thickness, roughness and composition of the layers were studied using scanning electron microscopy, scanning transmission electron microscopy with energy dispersive X-ray spectroscopy, X-ray diffraction and atomic force microscopy. Analysis showed that the resulting multilayers were continuous layers with a root mean square roughness of 30 nm and a grain size of 20-60 nm. The Cu substrate and the electrodeposited Cu layer were preferentially (200) oriented while the NiFe layers were polycrystalline but with a preferred (200) texture. The thinnest multilayers produced were 20/40, NiFe/Cu, respectively. - Research Highlights: {yields} Thin MLs of Cu and Py can be ED utilizing a pulsed-galvanostatic, DBT. {yields} The resulting multilayers were continuous layers with an rms of 30 nm. {yields} The smallest average thickness achieved by DBT was 40 nm/20 nm for Cu/NiFe.},
doi = {10.1016/J.MATCHAR.2010.11.017},
url = {https://www.osti.gov/biblio/22063663},
journal = {Materials Characterization},
issn = {1044-5803},
number = 2,
volume = 62,
place = {United States},
year = {Tue Feb 15 00:00:00 EST 2011},
month = {Tue Feb 15 00:00:00 EST 2011}
}