Etching properties and electrical characterization of surfaces of silicon-on-insulator substrates in presence of halogens

Journal Article · Thu Mar 15 00:00:00 EDT 2012 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.3695455· OSTI ID:22036833

Abbadie, A; Hamaide, G; Chaupin, M; Brunier, F ^[1]; Mariolle, D; Martinez, E ^[2]; Maehliss, J ^[3]

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1. SOITEC, Parc Technologique des Fontaines, 38920 Crolles cedex (France)
2. CEA, LETI, MINATEC, F38054 Grenoble (France)
3. Goethe University, Institute of Inorganic and Analytical Chemistry, 60438 Frankfurt (Germany)

We have studied the etching properties of silicon-on-insulator (SOI) substrates in recently developed chromium-free solutions containing halogens. We have shown that the presence of halogen compounds X (I{sup -}, Br{sup -}...) in HF/HNO{sub 3}/CH{sub 3}COOH solutions is required for a selective and preferential etching on SOI. The etching rate of such solutions increases with the dissolved halogen concentrations. The chemical reactivity of Si-X (X = Br{sup -}, I{sup -}..) bonds has been analyzed by X-ray Photoelectron Spectroscopy (XPS), Pseudo-MOS (flatband potential) and Kelvin Force Microscopy (KFM) measurements. A negative shift of flatband potential values is explained by an increasing concentration of halogen compounds in the solution and a substitution of Si-H (F) bonds by Si-X bonds during the reaction. Though Si-X bonds, and more particularly Si-I bonds, have been confirmed only at trace levels using XPS, we believe that the formation of Si-X bonds is supported by a mechanism of surface dipoles. Unexpectedly, no significant change in work function could be detected using KFM measurements. Some suggestions, based on KFM technique improvements, are made to explain such results. Finally, though the interaction mechanism between silicon, fluoride, iodide, and nitric acid is not clearly elucidated by our experimental results, the formation of Si-halogen bonds is crucial for etching and defect decoration capability.

• OSTI ID: 22036833
• Journal Information: Journal of Applied Physics, Vol. 111, Issue 6; Other Information: (c) 2012 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
37 INORGANIC
ORGANIC
PHYSICAL AND ANALYTICAL CHEMISTRY
ACETIC ACID
BROMINE IONS
CHEMICAL BONDS
ETCHING
HYDROFLUORIC ACID
IODINE IONS
MICROSCOPY
NITRIC ACID
REACTIVITY
SEMICONDUCTOR MATERIALS
SILICON
SILICON FLUORIDES
SILICON OXIDES
SUBSTRATES
WORK FUNCTIONS
X-RAY PHOTOELECTRON SPECTROSCOPY