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Title: Comparison between chemical vapor deposited and physical vapor deposited WSi{sub 2} metal gate for InGaAs n-metal-oxide-semiconductor field-effect transistors

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.3584024· OSTI ID:21518416
;  [1]; ;  [2];  [1];  [1]
  1. Advanced Materials for Micro and Nano-Systems, Singapore-MIT Alliance, Singapore 637460 (Singapore)
  2. School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore)

We compare chemical vapor deposition (CVD) and physical vapor deposition (PVD) WSi{sub 2} metal gate process for In{sub 0.53}Ga{sub 0.47}As n-metal-oxide-semiconductor field-effect transistors using 10 and 6.5 nm Al{sub 2}O{sub 3} as dielectric layer. The CVD-processed metal gate device with 6.5 nm Al{sub 2}O{sub 3} shows enhanced transistor performance such as drive current, maximum transconductance and maximum effective mobility. These values are relatively better than the PVD-processed counterpart device with improvement of 51.8%, 46.4%, and 47.8%, respectively. The improvement for the performance of the CVD-processed metal gate device is due to the fluorine passivation at the oxide/semiconductor interface and a nondestructive deposition process.

OSTI ID:
21518416
Journal Information:
Applied Physics Letters, Vol. 98, Issue 18; Other Information: DOI: 10.1063/1.3584024; (c) 2011 American Institute of Physics; ISSN 0003-6951
Country of Publication:
United States
Language:
English

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