A new optically transparent silicon containing polyimide film

Conference · Sun Dec 31 00:00:00 EST 1995

OSTI ID:215154

Kumar, D; Gupta, A D ^[1]

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1. Univ. of Delhi (India)

A new optically transparent, heat-resistant, flexible silicon containing polyimide (PI)(SIDA-BAPB) film has been developed. It was characterized by UV-Visible, FT-IR, differential scanning calorimetery (DSC), thermomechanical analysis (TMA) and thermogravimetric (TGA) analysis. The developed film showed high optical transparency in the 350-600 nm range of electromagnetic spectrum. The DSC analysis of the film showed glass transition temperature (T{sub g}) at 200{degrees}C. The dynamic thermogravimetric analysis (TGA) demonstrated its polymer decomposition temperature at 425{degrees}C. The char yield of the amorphous film in nitrogen at 800{degrees}C was 61%.

• OSTI ID: 215154
• Report Number(s): CONF-950801-; TRN: 96:000922-0675
• Resource Relation: Conference: 210. national meeting of the American Chemical Society (ACS), Chicago, IL (United States), 20-25 Aug 1995; Other Information: PBD: 1995; Related Information: Is Part Of 210th ACS national meeting. Part 1 and 2; PB: 1866 p.
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
SILICON
OPTICAL PROPERTIES
ORGANIC POLYMERS
IMIDES
COATINGS
TRANSITION TEMPERATURE
OPACITY