Thermal Aspects of Ductile Mode Micro Laser Assisted Machining

Journal Article · Mon Jan 17 00:00:00 EST 2011 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.3552331· OSTI ID:21510140

Virkar, Saurabh R ^[1]; Patten, John A ^[2]

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1. Industrial Engineering, Western Michigan University (United States)
2. Manufacturing Engineering, WMU (United States)

This paper presents the simulation work performed to study an innovative process called micro-Laser Assisted Machining ({mu}-LAM). {mu}-LAM is being used for machining hard and brittle semiconductor and ceramic materials such as Silicon Carbide. Numerical simulations were carried out using the commercial software AdvantEdge Version 5.4. The cutting tool is modeled as a single point diamond tip. The workpiece material (4H-SiC) is heated locally during the actual machining process by a laser beam, which passes through the diamond tool tip. The workpiece is heated beyond the thermal softening point in order to study the effect of increased temperature on the machining process. The initial work started with an approximate thermal softening curve to ensure that thermal effects can be incorporated in the simulation model. A new thermal softening curve was developed based upon experimental data and implemented in the material model. A thermal boundary was provided on the workpiece top surface to simulate the effect of laser heating. In all three cases the chip formation was observed and the changes in cutting and thrust forces were evaluated. The simulation results indicate a significant decrease in machining forces if Silicon Carbide is heated and thermally softened thus demonstrating the benefits of the {mu}-LAM process.

• OSTI ID: 21510140
• Journal Information: AIP Conference Proceedings, Vol. 1315, Issue 1; Conference: AMPT2010: International conference on advances in materials and processing technologies, Paris (France), 24-27 Oct 2010; Other Information: DOI: 10.1063/1.3552331; (c) 2010 American Institute of Physics; ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
APPROXIMATIONS
BEAMS
CERAMICS
COMPUTERIZED SIMULATION
CUTTING
CUTTING TOOLS
DIAMONDS
LASER-RADIATION HEATING
SEMICONDUCTOR MATERIALS
SILICON CARBIDES
SURFACES
CALCULATION METHODS
CARBIDES
CARBON
CARBON COMPOUNDS
ELEMENTS
EQUIPMENT
HEATING
MACHINING
MATERIALS
MINERALS
NONMETALS
PLASMA HEATING
SILICON COMPOUNDS
SIMULATION
TOOLS