Self-masking controlled by metallic seed layer during glass dry-etching for optically scattering surfaces
- Integrated Optoelectronics and Microoptics Research Group, Department of Physics, Kaiserslautern University of Technology, P.O. Box 3049, D-67653 Kaiserslautern (Germany)
During reactive ion etching in a high density Ar/CF{sub 4} plasma, nonvolatile halogen compounds are generated on the glass surface and act as statistically distributed micromasks. As a consequence surface roughness occurs, which can be used as additional surface functionality in certain classes of applications, where defined optical scattering is desired. The glass etch process described in this contribution enables user-defined scattering characteristics. The deposition of a thin metallic layer of Cu on top of the samples before dry-etching provides an additional seed for the production of micromasks, resulting in higher reproducibility. By varying the etch parameters a multitude of different surface morphologies can be realized both on borosilicate glasses and on fused silica.
- OSTI ID:
- 21476122
- Journal Information:
- Journal of Applied Physics, Vol. 107, Issue 3; Other Information: DOI: 10.1063/1.3290969; (c) 2010 American Institute of Physics; ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
SUPERCONDUCTIVITY AND SUPERFLUIDITY
70 PLASMA PHYSICS AND FUSION TECHNOLOGY
36 MATERIALS SCIENCE
BOROSILICATE GLASS
CARBON TETRAFLUORIDE
COPPER
DEPOSITION
ETCHING
LAYERS
MASKING
MORPHOLOGY
PLASMA
PLASMA DENSITY
ROUGHNESS
SCATTERING
SILICA
SPUTTERING
SURFACES
ELEMENTS
FLUORINATED ALIPHATIC HYDROCARBONS
GLASS
HALOGENATED ALIPHATIC HYDROCARBONS
METALS
MINERALS
ORGANIC COMPOUNDS
ORGANIC FLUORINE COMPOUNDS
ORGANIC HALOGEN COMPOUNDS
OXIDE MINERALS
SURFACE FINISHING
SURFACE PROPERTIES
TRANSITION ELEMENTS