DEVELOPMENT OF A LOW HEAT LEAK CFRP STAND FOR MIRI COOLER JT HEAT EXCHANGER STAGE

Journal Article · Fri Apr 09 00:00:00 EDT 2010 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.3422260· OSTI ID:21371777

Makowski, K P; Hayashil, B ^[1]; Larson, M E; Loc, A S; Zhang, B X; Leland, R S ^[2]

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1. Alliance Spacesystems, LLC, Pasadena, CA 91103 (United States)
2. Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA 91109 (United States)

A low heat leak stand is being developed for the Heat exchanger Stage Assembly (HSA) of the cryocooler subsystem for the Mid Infra-Red Instrument (MIRI) of the James Webb Space Telescope (JWST). The HSA stand is a hexapod structure supporting the 18 K HSA in a nominal 40 K background environment. Carbon fiber reinforced plastic (CFRP) has been selected for this application to meet the stringent design requirements of a low parasitic heat leak (less than 3.8 mW including both conductive and radiative heat loads for the thermal environment defined above) and a resonance frequency above 120 Hz. A directional lay-up of T300/polycyanate has been chosen for the construction of the hexapod struts. End fittings made of Invar 36 are bonded to the struts to provide structural interfaces. The development effort includes fabricating and testing (including cryogenic thermal cycling) six types of coupons for material characterization, determination of structural degradation due to thermal cycling, and selection of the joint bonding epoxy. Consequently, strut samples are used for final material characterization, performance assessment, and bond joint design evaluation. This paper describes the development process and addresses the challenges in meeting the design requirements. Results of finite element analysis (FEA) for the composite structure and experimental data collected through structural and thermal testing are also presented.

• OSTI ID: 21371777
• Journal Information: AIP Conference Proceedings, Vol. 1218, Issue 1; Conference: International cryogenic materials conference (ICMC) on advances in cryogenic engineering materials, Tucson, AZ (United States), 28 Jun - 2 Jul 2009; Other Information: DOI: 10.1063/1.3422260; (c) 2010 American Institute of Physics; ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
CARBON FIBERS
COMPOSITE MATERIALS
CRYOGENICS
DESIGN
ELECTRICAL ENGINEERING
EPOXIDES
FINITE ELEMENT METHOD
HEAT EXCHANGERS
HEAT LOSSES
HEATING LOAD
INVAR
PERFORMANCE
REINFORCED PLASTICS
TELESCOPES
TEMPERATURE RANGE 0013-0065 K
THERMAL CYCLING
THERMAL TESTING
ALLOYS
CALCULATION METHODS
ENERGY LOSSES
ENERGY TRANSFER
ENGINEERING
FIBERS
HEAT TRANSFER
IRON ALLOYS
IRON BASE ALLOYS
LOSSES
MATERIALS
MATERIALS TESTING
MATHEMATICAL SOLUTIONS
NICKEL ALLOYS
NONDESTRUCTIVE TESTING
NUMERICAL SOLUTION
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
REINFORCED MATERIALS
SYNTHETIC MATERIALS
TEMPERATURE RANGE
TESTING
TRANSITION ELEMENT ALLOYS