MEASUREMENT OF ADHESION STRENGTH OF SOLID-STATE DIFFUSION BONDING BETWEEN NICKEL AND COPPER BY MEANS OF LASER SHOCK SPALLATION METHOD

Journal Article · Mon Dec 28 00:00:00 EST 2009 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.3295001· OSTI ID:21366837

Satou, M; Akamatsu, H; Hasegawa, A ^[1]

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1. Dept. Quantum Science and Energy Engineering, Tohoku University, Sendai 980-8579 (Japan)

Coating and bonding techniques between different materials are essential to the field of technology. Bond mechanism is of interest from scientific point of view. A well-established method to make bonding between unalloyed nickel and copper was utilized, that was solid-state diffusion bonding at elevated temperatures. Irradiation by Nd:YAG laser with 7ns-pulse width created shock wave that caused tensile stress after reflection at free surface. The adhesion strength was determined by the critical laser power that caused exfoliation of the bonding interface.

• OSTI ID: 21366837
• Journal Information: AIP Conference Proceedings, Vol. 1195, Issue 1; Conference: American Physical Society Topical Group on shock compression of condensed matter, Nashville, TN (United States), 28 Jun - 3 Jul 2009; Other Information: DOI: 10.1063/1.3295001; (c) 2009 American Institute of Physics; ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ABLATION
ADHESION
COPPER
DIFFUSION
NEODYMIUM LASERS
NICKEL
PULSES
REFLECTION
SHOCK WAVES
SPALLATION
STRESSES
ELEMENTS
LASERS
METALS
NUCLEAR REACTIONS
SOLID STATE LASERS
TRANSITION ELEMENTS