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Title: Interfacial and structural properties of sputtered HfO{sub 2} layers

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.3153953· OSTI ID:21359299
 [1];  [2]
  1. Department of Physics, Izmir Institute of Technology, Urla, TR-35430 Izmir (Turkey)
  2. Department of Physics, Middle East Technical University, TR-06531 Ankara (Turkey)

Magnetron sputtered HfO{sub 2} layers formed on a heated Si substrate were studied by spectroscopic ellipsometer (SE), x-ray diffraction (XRD), Fourier transform infrared (FTIR), and x-ray photoelectron spectroscopy (XPS) depth profiling techniques. The results show that the formation of a SiO{sub x} suboxide layer at the HfO{sub 2}/Si interface is unavoidable. The HfO{sub 2} thickness and suboxide formation are highly affected by the growth parameters such as sputtering power, O{sub 2}/Ar gas ratio during sputtering, sputtering time, and substrate temperature. XRD spectra show that the deposited film has (111) monoclinic phase of HfO{sub 2}, which is also supported by FTIR spectra. The atomic concentration and chemical environment of Si, Hf, and O have been measured as a function of depth starting from the surface of the sample by XPS technique. It shows that HfO{sub 2} layers of a few nanometers are formed at the top surface. Below this thin layer, Si-Si bonds are detected just before the Si suboxide layer, and then the Si substrate is reached during the depth profiling by XPS. It is clearly understood that the highly reactive sputtered Hf atoms consume some of the oxygen atoms from the underlying SiO{sub 2} to form HfO{sub 2}, leaving Si-Si bonds behind.

OSTI ID:
21359299
Journal Information:
Journal of Applied Physics, Vol. 106, Issue 1; Other Information: DOI: 10.1063/1.3153953; (c) 2009 American Institute of Physics; ISSN 0021-8979
Country of Publication:
United States
Language:
English