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Title: Characterization of plasma etching induced interface states at Ti/p-SiGe Schottky contacts

Journal Article · · Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films
DOI:https://doi.org/10.1116/1.2913576· OSTI ID:21192384
;  [1]
  1. Physics Department, Sultan Qaboos University, P.O. Box 36 Muscat 123 (Oman)

The authors have used current-voltage (I-V) data measured over a wide temperature range (100-300 K) complemented by deep level transient spectroscopy (DLTS) for the assessment of the defects introduced in Si{sub 0.95}Ge{sub 0.05} by argon plasma sputter etching. From DLTS, defect concentration depth profiling was extracted and revealed that the main defect introduced during argon plasma sputtering is located very close to the surface. I-V-T analysis shows that the electrical characteristics deviated from the ideal case and indicate the presence of interface states, resulting from the plasma etching induced surface states at Ti/Si{sub 0.95}Ge{sub 0.05} interface. The interface state density as well as its temperature dependence were obtained from forward bias I-V-T measurements by considering the bias dependence of effective barrier height {phi}{sub e}. It is found that interface states density is temperature dependent although weakly.

OSTI ID:
21192384
Journal Information:
Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films, Vol. 26, Issue 4; Other Information: DOI: 10.1116/1.2913576; (c) 2008 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 1553-1813
Country of Publication:
United States
Language:
English