On the discontinuous precipitation reaction and solute redistribution in a Cu-15%Ni-8%Sn alloy

Journal Article · Wed Oct 15 00:00:00 EDT 2008 · Materials Characterization

DOI:https://doi.org/10.1016/j.matchar.2008.01.007· OSTI ID:21137472

Alili, B; Bradai, D ^[1]

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1. Houari Boumediene University of Sciences and Technology, BP 32 El-Alia, Algiers (Algeria)

Optical and transmission electron microscopy studies have been undertaken in order to clarify some morphological aspects of the discontinuous precipitation (DP) reaction in a Cu-15Ni-8Sn (wt.%) alloy in the temperature range 800-950 K. The DP reaction proceeds in the ternary Cu-Ni-Sn system relatively fast (in binary Cu-Ni alloy is not present) with typical morphological features like change of growth direction, appearance and disappearance of solute-rich {gamma} lamellae. A fine continuous precipitation of single Ni and Sn-rich phase was also evidenced within the solute-depleted {alpha} lamellae. An energy-dispersive X-ray analysis showed the level of partitioning of the alloying elements. Most of the Ni and Sn is located in the {gamma} lamellae. However, the formula of the {gamma} lamellae is still close to (Cu{sub 3}Sn), which indicates that some Cu atoms are replaced by Ni.

• OSTI ID: 21137472
• Journal Information: Materials Characterization, Vol. 59, Issue 10; Other Information: DOI: 10.1016/j.matchar.2008.01.007; PII: S1044-5803(08)00030-2; Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER ALLOYS
LAMELLAE
MICROANALYSIS
NICKEL ALLOYS
PRECIPITATION
TEMPERATURE RANGE 1000-4000 K
TIN ALLOYS
TRANSMISSION ELECTRON MICROSCOPY