Structural, magnetic, and mechanical properties of 5 {mu}m thick SmCo films suitable for use in microelectromechanical systems

Journal Article · Fri Feb 15 00:00:00 EST 2008 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.2840131· OSTI ID:21133954

Walther, A ^[1]; Givord, D; Dempsey, N M ^[1]; Khlopkov, K; Gutfleisch, O ^[2]

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1. Institut Neel, CNRS-UJF, 25 rue des Martyrs, 38042 Grenoble (France)
2. IFW Dresden, Institute of Metallic Materials, Helmholtzstr. 20, 01069 Dresden (Germany)

5 {mu}m thick SmCo films were deposited onto Si substrates using triode sputtering. A study of the influence of deposition temperature (T{sub dep}{<=}600 deg. C) on the structural, magnetic, and mechanical properties has shown that optimum properties [highest degree of in-plane texture, maximum in-plane coercivity and remanence (1.3 and 0.8 T, respectively), and no film peel-off] are achieved for films deposited at the relatively low temperature of 350 deg. C. This temperature is compatible with film integration into microelectromechanical systems. The deposition rate was increased from 3.6 to 18 {mu}m/h by increasing the surface area of the target from 7 to 81 cm{sup 2} while keeping the target potential fixed. Mechanically intact films could be prepared by deposition onto prepatterned films or deposition through a mask.

• OSTI ID: 21133954
• Journal Information: Journal of Applied Physics, Vol. 103, Issue 4; Other Information: DOI: 10.1063/1.2840131; (c) 2008 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BINARY ALLOY SYSTEMS
COBALT ALLOYS
COERCIVE FORCE
DEPOSITION
MECHANICAL PROPERTIES
MICROSTRUCTURE
SAMARIUM ALLOYS
SILICON
SPUTTERING
SUBSTRATES
SURFACE AREA
TEMPERATURE DEPENDENCE
TEMPERATURE RANGE 0400-1000 K
TEXTURE
THIN FILMS