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Title: Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering

Abstract

Additions of bis-(sodium sulfopropyl)-disulfide (SPS) to the Cu electroplating bath strongly affected the characteristics of Kirkendall void formation when the Cu film is soldered with Sn-3.5Ag solder and subsequently aged. Voids were predominantly distributed near the Cu{sub 3}Sn/Cu interface with SPS, but randomly distributed in the Cu{sub 3}Sn layer without SPS. In situ Auger electron spectroscopy of voids at the Cu{sub 3}Sn/Cu interface revealed surface segregation of S atoms, which came from SPS put into the bath as an additive. The S segregation to Cu{sub 3}Sn/Cu interface lowers the interface energy, thereby accelerating the void nucleation. Assisted by the high surface diffusivity of Cu and the presence of excess vacancies arising from the Kirkendall effect, voids tend to localize at the interface, which would result in serious degradation of the joint reliability.

Authors:
;  [1]
  1. Department of Materials Science and Engineering, KAIST, 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701 (Korea, Republic of)
Publication Date:
OSTI Identifier:
21120597
Resource Type:
Journal Article
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Volume: 92; Journal Issue: 9; Other Information: DOI: 10.1063/1.2890072; (c) 2008 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0003-6951
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ADDITIVES; AGING; AUGER ELECTRON SPECTROSCOPY; COPPER; DISULFIDES; ELECTROPLATING; FILMS; IMPURITIES; KIRKENDALL EFFECT; LAYERS; NUCLEATION; SEGREGATION; SODIUM COMPOUNDS; SOLDERING; VACANCIES; VOIDS

Citation Formats

Kim, J Y, and Jin, Yu. Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering. United States: N. p., 2008. Web. doi:10.1063/1.2890072.
Kim, J Y, & Jin, Yu. Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering. United States. https://doi.org/10.1063/1.2890072
Kim, J Y, and Jin, Yu. 2008. "Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering". United States. https://doi.org/10.1063/1.2890072.
@article{osti_21120597,
title = {Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering},
author = {Kim, J Y and Jin, Yu},
abstractNote = {Additions of bis-(sodium sulfopropyl)-disulfide (SPS) to the Cu electroplating bath strongly affected the characteristics of Kirkendall void formation when the Cu film is soldered with Sn-3.5Ag solder and subsequently aged. Voids were predominantly distributed near the Cu{sub 3}Sn/Cu interface with SPS, but randomly distributed in the Cu{sub 3}Sn layer without SPS. In situ Auger electron spectroscopy of voids at the Cu{sub 3}Sn/Cu interface revealed surface segregation of S atoms, which came from SPS put into the bath as an additive. The S segregation to Cu{sub 3}Sn/Cu interface lowers the interface energy, thereby accelerating the void nucleation. Assisted by the high surface diffusivity of Cu and the presence of excess vacancies arising from the Kirkendall effect, voids tend to localize at the interface, which would result in serious degradation of the joint reliability.},
doi = {10.1063/1.2890072},
url = {https://www.osti.gov/biblio/21120597}, journal = {Applied Physics Letters},
issn = {0003-6951},
number = 9,
volume = 92,
place = {United States},
year = {Mon Mar 03 00:00:00 EST 2008},
month = {Mon Mar 03 00:00:00 EST 2008}
}