Effect of thermal annealing on the sensitivity of Si-based MOS diodes to reducing gases
- Kuznetsov Physicotechnical Institute (Russian Federation)
- Russian Academy of Sciences, Institute of Strength Physics and Materials Science, Siberian Division (Russian Federation)
We study the effect of thermal annealing in the range of 200-610 deg. C on the sensitivity and time dependences of the response of the Pd-SiO{sub 2}-n-Si diodes to hydrogen and ammonia. The postannealing surface of a Pd electrode was examined using atomic force microscopy. The high-frequency C-V characteristics were measured in air and gas mixtures H{sub 2}-air and NH{sub 3}-air. It is shown that, after annealing at 200 deg. C for 10 min, the response of diode capacitance to hydrogen is higher than that to ammonia. After annealing at 300 deg. C and higher, the sensitivity of MOS diodes to hydrogen nearly vanishes. The response to ammonia still remains high, although it gradually weakens as the annealing temperature is increased. A decrease in sensitivity of the Pd-SiO{sub 2}-n-Si diodes to ammonia with increasing temperature is attributed to worsening of the electrical characteristics of the Pd electrode.
- OSTI ID:
- 21088622
- Journal Information:
- Semiconductors, Vol. 40, Issue 12; Other Information: DOI: 10.1134/S1063782606120128; Copyright (c) 2006 Nauka/Interperiodica; Article Copyright (c) 2006 Pleiades Publishing, Inc; Country of input: International Atomic Energy Agency (IAEA); ISSN 1063-7826
- Country of Publication:
- United States
- Language:
- English
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