The Surface Morphology Characterization of Electroless Nickel Immersion Gold Under Bump Metallurgy (UBM) Using SEM

Journal Article · Wed May 09 00:00:00 EDT 2007 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.2739836· OSTI ID:21061695

Arshad, M K. Md; Isa, M N. Md; Sohiful, Z M. A. ^[1]

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1. School of Microelectronic, Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), Blok A, Kompleks Pusat Pengajian KUKUM, Jalan Kangar-Arau, 02600 Jejawi, Perlis (Malaysia)

This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond pad, followed by cleaning, activation, first zincation, zinc removal, second zincation, electroless nickel and lastly immersion gold process. The result shows that the surface morphology of initial bond pad starts to change with deposition of zinc layer and further changes with deposition of nickel and gold layer.

• OSTI ID: 21061695
• Journal Information: AIP Conference Proceedings, Vol. 909, Issue 1; Conference: ICSSST 2006: 2. international conference on solid state science and technology 2006, Kuala Terengganu (Malaysia), 4-6 Sep 2006; Other Information: DOI: 10.1063/1.2739836; (c) 2007 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COATINGS
CRYSTAL STRUCTURE
DEPOSITION
GOLD
LAYERS
MORPHOLOGY
NICKEL
SCANNING ELECTRON MICROSCOPY
SURFACES
ZINC