Modeling Residual Stresses in Ceramic Plates

Journal Article · Fri Feb 15 00:00:00 EST 2008 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.2896869· OSTI ID:21055274

Cantavella, V; Moreno, A; Mezquita, A; Reig, Y ^[1]

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1. Instituto de Tecnologia Ceramica, Universitat Jaume I, 12006 Castellon (Spain)

The generation of residual stresses during cooling of layered ceramic plates has been modeled. Each plate comprises a body and two thin layers (engobe and glaze). The model takes into account two types of stresses: thermal stresses, resulting from temperature gradients inside the plate during cooling, and the stresses produced by the mismatch of the coefficient of thermal expansion (CTE) of the layers. The body has been simulated using a linear viscoelastic constitutive equation. The engobe and the glaze layer have been considered as elastic solids below a certain temperature (setting temperature: T{sub a}). Above T{sub a} these two layers have no mechanical influence on the body.

• OSTI ID: 21055274
• Journal Information: AIP Conference Proceedings, Vol. 973, Issue 1; Conference: M and FGM 2006: Conference on multiscale and funtionally graded materials 2006, Oahu Island, HI (United States), 15-18 Oct 2006; Other Information: DOI: 10.1063/1.2896869; (c) 2008 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
CERAMICS
COMPUTERIZED SIMULATION
ELASTICITY
GLAZES
HEAT TRANSFER
LAYERS
PLATES
RESIDUAL STRESSES
SOLIDS
TEMPERATURE GRADIENTS
THERMAL EXPANSION
THERMAL STRESSES
THIN FILMS
VISCOSITY