Effect of Film Thickness on the Thermo-Mechanical Behavior of Unpassivated Cu(Ag) Thin Films during Thermal Cycling

Journal Article · Tue Feb 07 00:00:00 EST 2006 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.2173531· OSTI ID:20798199

Strehle, S; Menzel, S; Wendrock, H; Gemming, T; Wetzig, K ^[1]

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1. Institute for Solid State and Materials Research Dresden, P.O. Box 27 01 16, 01171 Dresden (Germany)

The stress-temperature and stress-time behavior in electrochemically deposited Cu(1.5 at% Ag) was investigated by substrate curvature measurements. Film stress is separated into the average stress in the grain boundary and the average stress in the grain volume by assuming that grain boundary diffusion is the dominant stress relaxation mechanism. The athermal flow stress, the activation energy for grain boundary diffusion, and the elastic properties are discussed in dependence on film thickness.

• OSTI ID: 20798199
• Journal Information: AIP Conference Proceedings, Vol. 817, Issue 1; Conference: 8. international workshop on stress-induced phenomena in metallization, Dresden (Germany), 12-14 Sep 2005; Other Information: DOI: 10.1063/1.2173531; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ACTIVATION ENERGY
COPPER ALLOYS
DIFFUSION
ELASTICITY
FLOW STRESS
GRAIN BOUNDARIES
SILVER ALLOYS
STRESS RELAXATION
SUBSTRATES
THERMAL CYCLING
THERMOMECHANICAL TREATMENTS
THICKNESS
THIN FILMS