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Title: Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish

Abstract

SnAg solder bump is one bump type which is used to replace eutectic SnPb bumps. In this work tests have been done to characterize the reliability properties of this bump type. Electromigration (EM) tests, which were accelerated by high current and high temperature and high temperature storage (HTS) tests were performed. It was found that the reliability properties are sensitive to the material combinations in the interconnect stack. The interconnect stack includes substrate pad, pad finish, bump, underbump metallization (UBM) and the chip pad. Therefore separate test groups for SnAg bumps on Cu substrate pads with organic solderability preservative (OSP) finish and the identical bumps on pads with Ni/Au finish were used. In this paper the reliability test results and the corresponding failure analysis are presented. Some explanations about the differences in formation of intermetallic compounds (IMCs) are given.

Authors:
; ; ;  [1]
  1. Infineon Technologies AG, Otto-Hahn-Ring 6, 81739 Munich (Germany)
Publication Date:
OSTI Identifier:
20798196
Resource Type:
Journal Article
Journal Name:
AIP Conference Proceedings
Additional Journal Information:
Journal Volume: 817; Journal Issue: 1; Conference: 8. international workshop on stress-induced phenomena in metallization, Dresden (Germany), 12-14 Sep 2005; Other Information: DOI: 10.1063/1.2173569; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0094-243X
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ELECTROPHORESIS; EUTECTICS; FAILURES; HIGH-TC SUPERCONDUCTORS; INTERMETALLIC COMPOUNDS; MATERIALS TESTING; RELIABILITY; SILVER ALLOYS; STABILITY; SUBSTRATES; TIN ALLOYS

Citation Formats

Bauer, R, Ebersberger, B, Kupfer, C, and Alexa, L. Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish. United States: N. p., 2006. Web. doi:10.1063/1.2173569.
Bauer, R, Ebersberger, B, Kupfer, C, & Alexa, L. Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish. United States. https://doi.org/10.1063/1.2173569
Bauer, R, Ebersberger, B, Kupfer, C, and Alexa, L. 2006. "Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish". United States. https://doi.org/10.1063/1.2173569.
@article{osti_20798196,
title = {Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish},
author = {Bauer, R and Ebersberger, B and Kupfer, C and Alexa, L},
abstractNote = {SnAg solder bump is one bump type which is used to replace eutectic SnPb bumps. In this work tests have been done to characterize the reliability properties of this bump type. Electromigration (EM) tests, which were accelerated by high current and high temperature and high temperature storage (HTS) tests were performed. It was found that the reliability properties are sensitive to the material combinations in the interconnect stack. The interconnect stack includes substrate pad, pad finish, bump, underbump metallization (UBM) and the chip pad. Therefore separate test groups for SnAg bumps on Cu substrate pads with organic solderability preservative (OSP) finish and the identical bumps on pads with Ni/Au finish were used. In this paper the reliability test results and the corresponding failure analysis are presented. Some explanations about the differences in formation of intermetallic compounds (IMCs) are given.},
doi = {10.1063/1.2173569},
url = {https://www.osti.gov/biblio/20798196}, journal = {AIP Conference Proceedings},
issn = {0094-243X},
number = 1,
volume = 817,
place = {United States},
year = {Tue Feb 07 00:00:00 EST 2006},
month = {Tue Feb 07 00:00:00 EST 2006}
}