Strain Energy Effects on Texture Evolution in Thin Films: Biaxial vs. Uniaxial Stress State

Journal Article · Tue Feb 07 00:00:00 EST 2006 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.2173549· OSTI ID:20798177

Sonnweber-Ribic, P ^[1]; Dehm, G ^[2]; Gruber, P ^[3]; Arzt, E ^[1]

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1. Max Planck Institute for Metal Research, Heisenbergstrasse 3, 70569 Stuttgart (Germany)
2. Department Material Physics, University of Leoben, Jahnstrasse 12, 8700 Leoben (Austria)
3. Institute for Physical Metallurgy, University of Stuttgart, Heisenbergstrasse 3, 70569 Stuttgart (Germany)

Grain growth in thin films is usually accompanied by texture evolution due to the crystallographic dependencies of surface, interface and strain energies. In this work the driving forces for grain growth for a 1 and 5 {mu}m thick Cu thin film on a polyimide substrate are calculated assuming biaxial and uniaxial stress. While the results for the biaxial stress state are used to explain observed textures, for the case of uniaxial stress predictions suggest new ways to control the texture of thin films.

• OSTI ID: 20798177
• Journal Information: AIP Conference Proceedings, Vol. 817, Issue 1; Conference: 8. international workshop on stress-induced phenomena in metallization, Dresden (Germany), 12-14 Sep 2005; Other Information: DOI: 10.1063/1.2173549; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
COPPER
EVOLUTION
GRAIN GROWTH
INTERFACES
STRAINS
STRESSES
SUBSTRATES
SURFACES
TEXTURE
THIN FILMS