X-ray diffraction line profile analysis for defect study in Cu-1 wt.% Cr-0.1 wt.% Zr alloy

Journal Article · Tue Feb 15 00:00:00 EST 2005 · Materials Characterization

DOI:https://doi.org/10.1016/j.matchar.2004.09.009· OSTI ID:20748736

Kapoor, K ^[1]; Lahiri, D ^[1]; Batra, I S ^[2]; Rao, S V.R. ^[1]; Sanyal, T ^[1]

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1. Advanced Materials Characterisation Laboratory, Nuclear Fuel Complex, Hyderabad 500 062 (India)
2. Materials Science Division, Bhabha Atomic Research Center, Trombay, Mumbai 400 094 (India)

X-ray line profile analysis (LPA) has been used for microstructural analysis of a Cu-1 wt.% Cr-0.1 wt.% Zr alloy. Using this technique, the stacking fault probability (SFP) and stacking fault energy (SFE) has been determined for the pure Cu and the Cu-1 wt.% Cr-0.1 wt.% Zr alloy. It is observed that there is an increase in the stacking fault probability (and corresponding decrease in stacking fault energy) in case of the alloy. The increased formation of faulted regions in the Cu-1 wt.% Cr-0.1 wt.% Zr alloy is supported by the observation of extended dislocation nodes and fringe contrast due to staking faults under TEM, and higher work hardening rate in the tension test. The high thermal fatigue resistance of this alloy is attributed to decrease in the stacking fault energy by addition of Cr and Zr to Cu.

• OSTI ID: 20748736
• Journal Information: Materials Characterization, Vol. 54, Issue 2; Other Information: DOI: 10.1016/j.matchar.2004.09.009; PII: S1044-5803(04)00212-8; Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALLOYS
DEFECTS
DISLOCATIONS
PROBABILITY
STACKING FAULTS
STRAIN HARDENING
THERMAL FATIGUE
TRANSMISSION ELECTRON MICROSCOPY
X RADIATION
X-RAY DIFFRACTION