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Title: Electrical resistance of island-containing thin metal interconnects on polymer substrates under high strain

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.2113417· OSTI ID:20719587
; ; ;  [1]
  1. Department of Physics, Brown University, Providence, Rhode Island 02912 (United States)

We have deposited thin metal films that include a granular indium layer on polymer substrates and observed the resistance of the film changed by a factor of less than 2, even as the sample is uniaxially stretched to the point of rupture ({approx}38% strain). The presence of a discontinuous layer of indium islands in these films maintains the electrical conductivity by providing a bridging mechanism across the cracks formed in the underlying continuous film layers. A simple model is used to relate the applied strain to the electrical resistance of the metal films. Furthermore, we present the data for these films under cyclic loading around a cylindrical mandrel which show that there is no change in resistance under these fatigue testing conditions for 10 000 loading cycles.

OSTI ID:
20719587
Journal Information:
Journal of Applied Physics, Vol. 98, Issue 8; Other Information: DOI: 10.1063/1.2113417; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
Country of Publication:
United States
Language:
English