Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere
- Micron Semiconductor Asia Pte Ltd., 990 Bendemeer Road, Singapore 339942 and School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 (Singapore)
A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-{mu}m-pitch flip-chip bond pads on a joint-in-via flex substrate architecture.
- OSTI ID:
- 20714034
- Journal Information:
- Journal of Applied Physics, Vol. 98, Issue 3; Other Information: DOI: 10.1063/1.1997291; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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