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Title: Effects of post-deposition annealing in O{sub 2} on the electrical characteristics of LaAlO{sub 3} films on Si

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1989447· OSTI ID:20702573
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  1. Instituto de Fisica, Universidade Federal do Rio Grande do Sul, CP 15051, 91501-970 Porto Alegre, RS (Brazil)

LaAlO{sub 3} films were deposited on p-type Si(100) by sputtering from a LaAlO{sub 3} target. CxV characteristics were determined in nonannealed and O{sub 2}-annealed capacitors having LaAlO{sub 3} films as dielectric and RuO{sub 2} as top electrode. Thermal annealing in O{sub 2} atmosphere reduced flat band voltage to acceptable values for advanced Si-based devices. {sup 16}O-{sup 18}O isotopic substitution was characterized by Rutherford backscattering spectrometry and nuclear resonant reaction profiling. Chemical analysis of the films was accomplished by x-ray photoelectron spectroscopy. The electrical improvements observed after thermal annealing in O{sub 2} were attributed to the incorporation of oxygen from the gas phase, possibly healing oxygen vacancies in the films and providing mobile oxygen to the interface.

OSTI ID:
20702573
Journal Information:
Applied Physics Letters, Vol. 87, Issue 2; Other Information: DOI: 10.1063/1.1989447; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English