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Title: Effects of thermal annealing on deep-level defects and minority-carrier electron diffusion length in Be-doped InGaAsN

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.1871334· OSTI ID:20668279
; ;  [1]
  1. School of Electrical and Electronic Engineering, Nanyang Technological University, 42 Nanyang Avenue, Singapore 639798 (Singapore)

We report the effects of ex situ thermal annealing on the deep-level defects and the minority-carrier electron diffusion length in Be-doped, p-type In{sub 0.03}Ga{sub 0.97}As{sub 0.99}N{sub 0.01} grown by solid source molecular-beam epitaxy. Deep-level transient spectroscopy measurements reveal two majority-carrier hole traps, HT1 (0.18 eV) and HT4 (0.59 eV), and two minority-carrier electron traps, ET1 (0.09 eV) and ET3 (0.41 eV), in the as-grown sample. For the sample with postgrowth thermal annealing, the overall deep-level defect-concentration is decreased. Two hole traps, HT2 (0.39 eV) and HT3 (0.41 eV), and one electron trap, ET2 (0.19 eV), are observed. We found that the minority-carrier electron diffusion length increases by {approx}30% and the leakage current of the InGaAsN/GaAs p-n junction decreases by 2-3 orders after thermal annealing. An increase of the net acceptor concentration after annealing is also observed and can be explained by a recently proposed three-center-complex model.

OSTI ID:
20668279
Journal Information:
Journal of Applied Physics, Vol. 97, Issue 7; Other Information: DOI: 10.1063/1.1871334; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
Country of Publication:
United States
Language:
English