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Title: TEM characterization of diffusion bonding of superplastic 8090 Al-Li alloy

Journal Article · · Scripta Materialia
; ;  [1]
  1. Universidad Complutense de Madrid (Spain)

In recent years there has been a growing interest in developing a joining process compatible with other fabrication technologies used in the aeronautical industry for superplastic aluminum-lithium alloys, and it is shown in numerous publications. There have been important advances in the research of the aluminum-lithium alloys diffusion bonding, and specially for the AA8090. However, joining of aluminum alloys by diffusion bonding encounters inherent problems which have not been solved yet. Most of these limitations come from the formation of protective oxide film (Al{sub 2}O{sub 3}) which covers the aluminum based materials. In spite of these unresolved difficulties, most of the investigators, among them are the present authors, have agreed that aluminum alloys which contain lithium as alloying element, present a higher weldability than Li-free aluminum ones. To explain this enhanced diffusion weldability in Li-doped alloys, it has been argued that Li favors the partial elimination of the unsoluble and tenacious alumina film, which acts as a diffusion barrier, through the formation of more soluble and brittle complex spinel (Al-Li-O). Nevertheless, the elimination of these oxides is not complete, resulting, in the most advantageous conditions, in a discontinuous distribution of oxide particles along the bonding interface which controls the final properties of the bond.

OSTI ID:
194939
Journal Information:
Scripta Materialia, Vol. 34, Issue 4; Other Information: PBD: 15 Feb 1996
Country of Publication:
United States
Language:
English

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