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Title: Method for gas bubble and void control and removal from metals

Patent ·
OSTI ID:187056

A method is described for enhancing the diffusion of gas bubbles or voids attached to impurity precipitates, and biasing their direction of migration out of the host metal (or metal alloy) by applying a temperature gradient across the host metal (or metal alloy). In the preferred embodiment of the present invention, the impurity metal is insoluble in the host metal and has a melting point lower than the melting point of the host material. Also, preferably the impurity metal is lead or indium and the host metal is aluminum or a metal alloy. 2 figs.

Research Organization:
EG & G Idaho Inc
DOE Contract Number:
AC07-76ID01570
Assignee:
Lockheed Idaho Technologies Co., Idaho Falls, ID (United States)
Patent Number(s):
US 5,490,187/A/
Application Number:
PAN: 8-259,201
OSTI ID:
187056
Resource Relation:
Other Information: PBD: 6 Feb 1996
Country of Publication:
United States
Language:
English