Stress build-up during the reaction of thermoset films cured above the ultimate T{sub g}
- Laboratoire de Technologie des Composites et Polymers, Lausanne (Switzerland)
- Royal Institute of Technology, Stockholm (Sweden)
The structure evolution and build-up of internal stresses in an acrylate and an epoxy cured above their ultimate T{sub g}`s have been investigated. The samples were cured isothermally and the structure evolvement followed using a parallel plate dynamic mechanical analyzer. From the dynamic-mechanical data a predicted stress build-up was calculated and compared with an experimentally observed stress level. The predictions show that the acrylate is expected to build up stresses two orders of magnitude greater than the opoxy. This discrepancy can be explained by the difference in structure and reaction mechanism between the monomers, notably the early gelation, high rubbery modulus and high cure shrinkage of the acrylates as compared to the epoxy. In the case of the acrylate the predicted stress level agrees well with experimental results. For the epoxy no stresses were observed, presumably due to their being below the measurability limit.
- OSTI ID:
- 141908
- Report Number(s):
- CONF-930304-; TRN: 93:003688-1596
- Resource Relation:
- Conference: 205. American Chemical Society national meeting, Denver, CO (United States), 28 Mar - 2 Apr 1993; Other Information: PBD: 1993; Related Information: Is Part Of 205th ACS national meeting; PB: 1951 p.
- Country of Publication:
- United States
- Language:
- English
Similar Records
Stress Relaxation in Epoxy Thermosets via a Ferrocene-Based Amine Curing Agent
Morphology development of rubber-modified epoxy thermosets