Ink composition for making a conductive silver structure
An ink composition for making a conductive silver structure comprises a silver salt and a complex of (a) a complexing agent and a short chain carboxylic acid or (b) a complexing agent and a salt of a short chain carboxylic acid, according to one embodiment. A method for making a silver structure entails combining a silver salt and a complexing agent, and then adding a short chain carboxylic acid or a salt of the short chain carboxylic acid to the combined silver salt and a complexing agent to form an ink composition. A concentration of the complexing agent in the ink composition is reduced to form a concentrated formulation, and the silver salt is reduced to form a conductive silver structure, where the concentrated formulation and the conductive silver structure are formed at a temperature of about 120.degree. C. or less.
- Research Organization:
- Univ. of Illinois at Urbana-Champaign, IL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FG02-07ER46471
- Assignee:
- The Board of Trustees of The University of Illinois (Urbana, IL)
- Patent Number(s):
- 9,469,773
- Application Number:
- 14/368,202
- OSTI ID:
- 1329320
- Resource Relation:
- Patent File Date: 2012 Dec 20
- Country of Publication:
- United States
- Language:
- English
Similar Records
Metal-Complex Inks for Lower Cost and Improved Passivation for Silicon Photovoltaic Metallization
Metal-Complex Inks for Lower Cost and Improved Passivation for Silicon Photovoltaic Metallization