Why are some Interfaces in Materials Stronger than others?

Fensin, Saryu J.; Cerreta, Ellen K.; Gray, George T.; Valone, Steven M.

doi:10.1038/srep05461

Title: Why are some Interfaces in Materials Stronger than others?

Journal Article · Thu Jun 26 00:00:00 EDT 2014 · Scientific Reports

DOI:https://doi.org/10.1038/srep05461· OSTI ID:1321741

Fensin, Saryu J. ^[1]; Cerreta, Ellen K. ^[1]; Gray, George T. ^[1]; Valone, Steven M. ^[1]

Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

Grain boundaries (GBs) are often the preferred sites for void nucleation in ductile metals. However, it has been observed that all boundaries do not contribute equally to this process. We present a mechanistic rationale for the role of GBs in damage nucleation in copper, along with a quantitative map for predicting preferred void nucleation at GBs based on molecular dynamics simulations in copper. Simulations show a direct correlation between the void nucleation stress and the ability of a grain boundary to plastically deform by emitting dislocations, during shock compression. Plastic response of a GB, affects the development of stress concentrations believed to be responsible for void nucleation by acting as a dissipation mechanism for the applied stress.

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Research Organization:: Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)

Sponsoring Organization:: USDOE

Grant/Contract Number:: AC52-06NA25396

OSTI ID:: 1321741

Report Number(s):: LA-UR-14-23562

Journal Information:: Scientific Reports, Vol. 4; ISSN 2045-2322

Publisher:: Nature Publishing GroupCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 44 works

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Dynamic failure in two-phase materials Fensin, S. J.; Walker, E. K.; Cerreta, E. K. Journal of Applied Physics, Vol. 118, Issue 23 https://doi.org/10.1063/1.4938109	journal	December 2015
Shock induced damage in copper: A before and after, three-dimensional study Menasche, David B.; Lind, Jonathan; Li, Shiu Fai Journal of Applied Physics, Vol. 119, Issue 15 https://doi.org/10.1063/1.4947270	journal	April 2016
Shock wave propagation and spall failure of nanocrystalline Cu/Ta alloys: Effect of Ta in solid-solution Chen, Jie; Tschopp, Mark A.; Dongare, Avinash M. Journal of Applied Physics, Vol. 122, Issue 22 https://doi.org/10.1063/1.5001761	journal	December 2017
Shock induced damage in copper: A before and after, three-dimensional study Menasche, David; Lind, Jonathan; Li, Shiu Fai Deutsches Elektronen-Synchrotron, DESY, Hamburg https://doi.org/10.3204/pubdb-2016-05301	text	January 2016
Influence of defects on the shock Hugoniot of tantalum Hahn, Eric N.; Fensin, Saryu J. Journal of Applied Physics, Vol. 125, Issue 21 https://doi.org/10.1063/1.5096526	journal	June 2019
Computational Analysis Methods in Atomistic Modeling of Crystals Stukowski, Alexander JOM, Vol. 66, Issue 3 https://doi.org/10.1007/s11837-013-0827-5	journal	December 2013
Dislocation content in random high angle grain boundaries Kuhr, Bryan; Farkas, Diana Modelling and Simulation in Materials Science and Engineering, Vol. 27, Issue 4 https://doi.org/10.1088/1361-651x/ab122e	journal	April 2019
Spall response of single-crystal copper Turley, W. D.; Fensin, S. J.; Hixson, R. S. Journal of Applied Physics, Vol. 123, Issue 5 https://doi.org/10.1063/1.5012267	journal	February 2018
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Effect of peak stress and tensile strain-rate on spall in tantalum Jones, D. R.; Fensin, S. J.; Martinez, D. T. Journal of Applied Physics, Vol. 124, Issue 8 https://doi.org/10.1063/1.5045045	journal	August 2018

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