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Title: Passive Two-Phase Cooling for Automotive Power Electronics

Experiments were conducted to evaluate the use of a passive two-phase cooling strategy as a means of cooling automotive power electronics. The proposed cooling approach utilizes an indirect cooling configuration to alleviate some reliability concerns and to allow the use of conventional power modules. An inverter-scale proof-of-concept cooling system was fabricated and tested using the refrigerants hydrofluoroolefin HFO-1234yf and hydrofluorocarbon HFC-245 fa. Results demonstrated that the system can dissipate at least 3.5 kW of heat with 250 cm3 of HFC-245fa. An advanced evaporator concept that incorporates features to improve performance and reduce its size was designed. Simulation results indicate the concept's thermal resistance can be 58% to 65% lower than automotive dual-side-cooled power modules. Tests were also conducted to measure the thermal performance of two air-cooled condensers-plain and rifled finned tube designs. The results combined with some analysis were then used to estimate the required condenser size per operating conditions and maximum allowable system (i.e., vapor and liquid) temperatures.
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Resource Relation:
Conference: 2014 30th Annual Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 9-13 March 2014, San Jose, California
Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE)
Research Org:
NREL (National Renewable Energy Laboratory (NREL), Golden, CO (United States))
Sponsoring Org:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
Country of Publication:
United States
30 DIRECT ENERGY CONVERSION; 33 ADVANCED PROPULSION SYSTEMS power electronics; thermal management; two-phase heat transfer