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Title: Novel masked mercaptans based on thiolacetic acid/diallyl bisphenol a adducts as hardeners for epoxy adhesive systems

Conference ·
OSTI ID:127042

Epoxy resin formulations based on these masked mercaptans show adhesive properties equivalent to epoxy resin formulations cured with classical hardeners such as dicyandiamide. In addition the use of the masked mercaptans as an epoxy resin hardener leads to adhesive joints which show outstanding resistance to moisture. Thus Al/Al joints cured with a clinical epoxy formulation based on dicyandiamide as hardener (AV 8) failed in 30 days after exposure to water at (90{degrees}C) for 90 days. We believe that chemi-adsorption at the interface between metal/adhesive/metal plays an important role in giving this outstanding hot water resistance. This paper discusses the synthesis, the mechanism of cure with epoxide resins and the adhesive properties of these novel masked mercaptans.

OSTI ID:
127042
Report Number(s):
CONF-950402-; TRN: 95:006086-1136
Resource Relation:
Conference: 209. American Chemical Society (ACS) national meeting, Anaheim, CA (United States), 2-6 Apr 1995; Other Information: PBD: 1995; Related Information: Is Part Of 209th ACS national meeting; PB: 2088 p.
Country of Publication:
United States
Language:
English