skip to main content

SciTech ConnectSciTech Connect

Title: Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.
; ;
Publication Date:
OSTI Identifier:
Report Number(s):
Journal ID: ISSN 0026-2714
DOE Contract Number:
Resource Type:
Journal Article
Resource Relation:
Journal Name: Microelectronics and Reliability; Journal Volume: 62; Related Information: Microelectronics Reliability
Research Org:
NREL (National Renewable Energy Laboratory (NREL), Golden, CO (United States))
Sponsoring Org:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Solar Energy Technologies Office (EE-4S); Solar Energy Research Institute for India and the U.S. (SERIIUS)
Country of Publication:
United States
14 SOLAR ENERGY; 36 MATERIALS SCIENCE photovoltaic reliability; solder fatigue; thermomechanical fatigue; acceleration factor; thermal cycling