In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

Shen, Hao; Zhu, Wenxin; Li, Yao; Tamura, Nobumichi; Chen, Kai

doi:10.1038/srep24418

Title: In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

Journal Article · Mon Apr 18 00:00:00 EDT 2016 · Scientific Reports

DOI:https://doi.org/10.1038/srep24418· OSTI ID:1256068

Shen, Hao ^[1]; Zhu, Wenxin ^[1]; Li, Yao ^[1]; Tamura, Nobumichi ^[2]; Chen, Kai ^[1]

Xi'an Jiaotong Univ. Xi'an, Shaanxi (China)
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Advanced Light Source (ALS)

Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature.

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Research Organization:: Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: AC02-05CH11231

OSTI ID:: 1256068

Alternate ID(s):: OSTI ID: 1379287

Journal Information:: Scientific Reports, Vol. 6; ISSN 2045-2322

Publisher:: Nature Publishing GroupCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 15 works

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References (39)

A look-up table based approach to characterize crystal twinning for synchrotron X-ray Laue microdiffraction scans Li, Yao; Wan, Liang; Chen, Kai Journal of Applied Crystallography, Vol. 48, Issue 3 https://doi.org/10.1107/s1600576715004896	journal	April 2015
Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction Chen, Kai; Tamura, N.; Valek, B. C. Journal of Applied Physics, Vol. 104, Issue 1 https://doi.org/10.1063/1.2952073	journal	July 2008
Theory of diffusion-accommodated grain rotation in columnar polycrystalline microstructures Moldovan, D.; Wolf, D.; Phillpot, S. R. Acta Materialia, Vol. 49, Issue 17 https://doi.org/10.1016/S1359-6454(01)00240-3	journal	October 2001
Visualizing size-dependent deformation mechanism transition in Sn Tian, Lin; Li, Ju; Sun, Jun Scientific Reports, Vol. 3, Issue 1 https://doi.org/10.1038/srep02113	journal	July 2013
Residual stress preserved in quartz from the San Andreas Fault Observatory at Depth Chen, K.; Kunz, M.; Tamura, N. Geology, Vol. 43, Issue 3 https://doi.org/10.1130/G36443.1	journal	February 2015
A synchrotron study of microstructure gradient in laser additively formed epitaxial Ni-based superalloy Xue, Jiawei; Zhang, Anfeng; Li, Yao Scientific Reports, Vol. 5, Issue 1 https://doi.org/10.1038/srep14903	journal	October 2015
Grain boundary effects on the mechanical properties of bismuth nanostructures Burek, Michael J.; Jin, Sumin; Leung, Michael C. Acta Materialia, Vol. 59, Issue 11 https://doi.org/10.1016/j.actamat.2011.04.017	journal	June 2011
Spontaneous growth mechanism of tin whiskers Lee, B. -Z.; Lee, D. N. Acta Materialia, Vol. 46, Issue 10 https://doi.org/10.1016/S1359-6454(98)00045-7	journal	June 1998
Diffusion of ${Sb}^{124}$ , ${Cd}^{109}$ , ${Sn}^{113}$ , and ${Zn}^{65}$ in tin Huang, F. H.; Huntington, H. B. Physical Review B, Vol. 9, Issue 4 https://doi.org/10.1103/PhysRevB.9.1479	journal	February 1974
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders Lu, Minhua; Shih, Da-Yuan; Lauro, Paul Applied Physics Letters, Vol. 92, Issue 21 https://doi.org/10.1063/1.2936996	journal	May 2008
Grain rotation in thin films of gold Harris, K. E.; Singh, V. V.; King, A. H. Acta Materialia, Vol. 46, Issue 8 https://doi.org/10.1016/S1359-6454(97)00467-9	journal	May 1998
Recent advances on electromigration in very-large-scale-integration of interconnects Tu, K. N. Journal of Applied Physics, Vol. 94, Issue 9 https://doi.org/10.1063/1.1611263	journal	November 2003
Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction Choi, W. J.; Lee, T. Y.; Tu, K. N. Acta Materialia, Vol. 51, Issue 20 https://doi.org/10.1016/S1359-6454(03)00448-8	journal	December 2003
Effect of current crowding on whisker growth at the anode in flip chip solder joints Ouyang, Fan-Yi; Chen, Kai; Tu, K. N. Applied Physics Letters, Vol. 91, Issue 23 https://doi.org/10.1063/1.2822446	journal	December 2007
Characterization of ion beam irradiated 304 stainless steel utilizing nanoindentation and Laue microdiffraction Lupinacci, A.; Chen, K.; Li, Y. Journal of Nuclear Materials, Vol. 458 https://doi.org/10.1016/j.jnucmat.2014.11.050	journal	March 2015
A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source Kunz, Martin; Tamura, Nobumichi; Chen, Kai Review of Scientific Instruments, Vol. 80, Issue 3 https://doi.org/10.1063/1.3096295	journal	March 2009
Electromigration in thin aluminum films on titanium nitride Blech, I. A. Journal of Applied Physics, Vol. 47, Issue 4, p. 1203-1208 https://doi.org/10.1063/1.322842	journal	April 1976
Electromigration-induced grain rotation in anisotropic conducting beta tin Wu, Albert T.; Gusak, A. M.; Tu, K. N. Applied Physics Letters, Vol. 86, Issue 24 https://doi.org/10.1063/1.1941456	journal	June 2005
Current-crowding-induced electromigration failure in flip chip solder joints Yeh, Everett C. C.; Choi, W. J.; Tu, K. N. Applied Physics Letters, Vol. 80, Issue 4 https://doi.org/10.1063/1.1432443	journal	January 2002
Kinetics and size effect of grain rotations in nanocrystals with rounded triple junctions Yang, Fan; Yang, Wei Scripta Materialia, Vol. 61, Issue 9 https://doi.org/10.1016/j.scriptamat.2009.07.039	journal	November 2009
Mechanical annealing and source-limited deformation in submicrometre-diameter Ni crystals Shan, Z. W.; Mishra, Raja K.; Syed Asif, S. A. Nature Materials, Vol. 7, Issue 2 https://doi.org/10.1038/nmat2085	journal	December 2007
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction Wu, Albert T.; Tu, K. N.; Lloyd, J. R. Applied Physics Letters, Vol. 85, Issue 13 https://doi.org/10.1063/1.1795353	journal	September 2004
Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment Budiman, A. S.; Hau-Riege, C. S.; Baek, W. C. Journal of Electronic Materials, Vol. 39, Issue 11 https://doi.org/10.1007/s11664-010-1356-4	journal	September 2010
Dislocations and Grain Size in Electrodeposited Nanocrystalline Ni Determined by the Modified Williamson–Hall and Warren–Averbach Procedures Ungár, T.; Révész, Á ;.; Borbély, A. Journal of Applied Crystallography, Vol. 31, Issue 4 https://doi.org/10.1107/S0021889897019559	journal	August 1998
Ultrasonic Attenuation at Low Temperatures for Metals in the Normal and Superconducting States Mason, W. P.; Bömmel, H. E. The Journal of the Acoustical Society of America, Vol. 28, Issue 5 https://doi.org/10.1121/1.1908524	journal	September 1956
Thermomigration in SnPb composite flip chip solder joints Huang, Annie T.; Gusak, A. M.; Tu, K. N. Applied Physics Letters, Vol. 88, Issue 14 https://doi.org/10.1063/1.2192694	journal	April 2006
Fabrication, microstructure, and mechanical properties of tin nanostructures Burek, Michael J.; Budiman, Arief Suriadi; Jahed, Zeinab Materials Science and Engineering: A, Vol. 528, Issue 18 https://doi.org/10.1016/j.msea.2011.04.019	journal	July 2011
XMAS: A Versatile Tool for Analyzing Synchrotron X-ray Microdiffraction Data Tamura, Nobumichi Strain and Dislocation Gradients from Diffraction https://doi.org/10.1142/9781908979636_0004	book	April 2014
Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing Shin, Hae-A-Seul; Kim, Byoung-Joon; Kim, Ju-Heon Journal of Electronic Materials, Vol. 41, Issue 4 https://doi.org/10.1007/s11664-012-1943-7	journal	February 2012
Electromigration-induced plastic deformation in passivated metal lines Valek, B. C.; Bravman, J. C.; Tamura, N. Applied Physics Letters, Vol. 81, Issue 22 https://doi.org/10.1063/1.1525880	journal	November 2002
In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction Chen, Kai; Tamura, N.; Kunz, M. Journal of Applied Physics, Vol. 106, Issue 2 https://doi.org/10.1063/1.3157196	journal	July 2009
A synchrotron study of defect and strain inhomogeneity in laser-assisted three-dimensionally-printed Ni-based superalloy Li, Yao; Qian, Dan; Xue, Jiawei Applied Physics Letters, Vol. 107, Issue 18 https://doi.org/10.1063/1.4934839	journal	November 2015
Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction Budiman, A. S.; Nix, W. D.; Tamura, N. Applied Physics Letters, Vol. 88, Issue 23 https://doi.org/10.1063/1.2210451	journal	June 2006
Direct observation of twinning in tin lamellae Tu, K. N.; Turnbull, D. Acta Metallurgica, Vol. 18, Issue 8 https://doi.org/10.1016/0001-6160(70)90019-2	journal	August 1970
Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect Barabash, R. I.; Ice, G. E.; Tamura, N. Journal of Applied Physics, Vol. 93, Issue 9 https://doi.org/10.1063/1.1563033	journal	May 2003
Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints Zhang, Lingyun; Ou, Shengquan; Huang, Joanne Applied Physics Letters, Vol. 88, Issue 1 https://doi.org/10.1063/1.2158702	journal	January 2006
Early stage of plastic deformation in thin films undergoing electromigration Valek, B. C.; Tamura, N.; Spolenak, R. Journal of Applied Physics, Vol. 94, Issue 6 https://doi.org/10.1063/1.1600843	journal	September 2003
Fabrication, structure and mechanical properties of indium nanopillars Lee, Gyuhyon; Kim, Ju-Young; Budiman, Arief Suriadi Acta Materialia, Vol. 58, Issue 4 https://doi.org/10.1016/j.actamat.2009.10.042	journal	February 2010
High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction Chen, Kai; Tamura, N.; Tang, Wei Journal of Applied Physics, Vol. 107, Issue 6 https://doi.org/10.1063/1.3309750	journal	March 2010

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Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints Zuo, Yong; Bieler, Thomas R.; Zhou, Quan Journal of Electronic Materials, Vol. 47, Issue 3 https://doi.org/10.1007/s11664-017-5980-0	journal	December 2017
Statistical study of ductility-dip cracking induced plastic deformation in polycrystalline laser 3D printed Ni-based superalloy Qian, Dan; Xue, Jiawei; Zhang, Anfeng Scientific Reports, Vol. 7, Issue 1 https://doi.org/10.1038/s41598-017-03051-x	journal	June 2017

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