Finite-temperature non-equilibrium quasi-continuum analysis of nanovoid growth in copper at low and high strain rates
Journal Article
·
· Mechanics of Materials
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 1246466
- Journal Information:
- Mechanics of Materials, Journal Name: Mechanics of Materials Vol. 90 Journal Issue: C; ISSN 0167-6636
- Publisher:
- ElsevierCopyright Statement
- Country of Publication:
- Netherlands
- Language:
- English
Cited by: 27 works
Citation information provided by
Web of Science
Web of Science
Similar Records
Strain rate dependence of the growth rate of grain boundary cavities during the high cycle high temperature fatigue of copper
An analysis of the low temperature, low and high strain-rate deformation of Ti-6Al-4V
Electron drag on mobile dislocations in copper and aluminum at low temperatures: Strain rate, temperature, and field dependence
Conference
·
Thu Jul 01 00:00:00 EDT 1999
·
OSTI ID:1246466
An analysis of the low temperature, low and high strain-rate deformation of Ti-6Al-4V
Journal Article
·
Mon May 01 00:00:00 EDT 1989
· Metallurgical Transactions, A (Physical Metallurgy and Materials Science); (USA)
·
OSTI ID:1246466
Electron drag on mobile dislocations in copper and aluminum at low temperatures: Strain rate, temperature, and field dependence
Journal Article
·
Mon Oct 01 00:00:00 EDT 1979
· J. Appl. Phys.; (United States)
·
OSTI ID:1246466