Sintering Kinetics of Inkjet Printed Conductive Silver Lines on Insulating Plastic Substrate

Zhou, Wenchao; List, III, Frederick Alyious; Duty, Chad E; Babu, Sudarsanam Suresh

doi:10.1007/s11663-014-0288-4

Title: Sintering Kinetics of Inkjet Printed Conductive Silver Lines on Insulating Plastic Substrate

Journal Article · Sat Jan 24 00:00:00 EST 2015 · Metallurgical and Materials Transactions. B, Process Metallurgy and Materials Processing Science

DOI:https://doi.org/10.1007/s11663-014-0288-4· OSTI ID:1234315

Zhou, Wenchao ^[1]; List, III, Frederick Alyious ^[1]; Duty, Chad E ^[1]; Babu, Sudarsanam Suresh ^[1]

Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

This paper focuses on sintering kinetics of inkjet printed lines containing silver nanoparticles deposited on a plastic substrate. Upon heat treatment, the change of resistance in the printed lines was measured as a function of time and sintering temperatures from 150 to 200 C. A critical temperature was observed for the sintering process, beyond which there was no further reduction in resistance. Analysis shows the critical temperature correlates to the boiling point of the solvent, which is attributed to a liquid-mediated sintering mechanism. It is demonstrated that the sintering process shuts down after the solvent has completely evaporated.

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Research Organization:: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Manufacturing Demonstration Facility (MDF)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE)

Grant/Contract Number:: AC05-00OR22725

OSTI ID:: 1234315

Journal Information:: Metallurgical and Materials Transactions. B, Process Metallurgy and Materials Processing Science, Vol. 46, Issue 3; ISSN 1073-5615

Publisher:: ASM InternationalCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 8 works

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References (28)

All-polymer RC filter circuits fabricated with inkjet printing technology Chen, Bin; Cui, Tianhong; Liu, Yi Solid-State Electronics, Vol. 47, Issue 5 https://doi.org/10.1016/S0038-1101(02)00443-4	journal	May 2003
Triggering the Sintering of Silver Nanoparticles at Room Temperature Magdassi, Shlomo; Grouchko, Michael; Berezin, Oleg ACS Nano, Vol. 4, Issue 4 https://doi.org/10.1021/nn901868t	journal	March 2010
Direct Fabrication of Electric Components on Insulated Boards by Laser Microcladding Electronic Pastes Zeng, X.; Li, X.; Liu, J. IEEE Transactions on Advanced Packaging, Vol. 29, Issue 2 https://doi.org/10.1109/TADVP.2005.853546	journal	May 2006
Thermal cure effects on electrical performance of nanoparticle silver inks Greer, Julia R.; Street, Robert A. Acta Materialia, Vol. 55, Issue 18 https://doi.org/10.1016/j.actamat.2007.07.040	journal	October 2007
Using convective flow splitting for the direct printing of fine copper lines Cuk, Tanja; Troian, Sandra M.; Hong, Cheong Min Applied Physics Letters, Vol. 77, Issue 13 https://doi.org/10.1063/1.1311954	journal	September 2000
Ink-Jet Printing of Cu−Ag-Based Highly Conductive Tracks on a Transparent Substrate Woo, Kyoohee; Kim, Dongjo; Kim, Jang Sub Langmuir, Vol. 25, Issue 1 https://doi.org/10.1021/la802182y	journal	January 2009
Conductive Inks with a “Built-In” Mechanism That Enables Sintering at Room Temperature Grouchko, Michael; Kamyshny, Alexander; Mihailescu, Cristina Florentina ACS Nano, Vol. 5, Issue 4 https://doi.org/10.1021/nn2005848	journal	March 2011
Inkjet Printing of Narrow Conductive Tracks on Untreated Polymeric Substrates van Osch, T. H. J.; Perelaer, J.; de Laat, A. W. M. Advanced Materials, Vol. 20, Issue 2 https://doi.org/10.1002/adma.200701876	journal	January 2008
Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions Kim, Dongjo; Jeong, Sunho; Park, Bong Kyun Applied Physics Letters, Vol. 89, Issue 26 https://doi.org/10.1063/1.2424671	journal	December 2006
Patterned low temperature copper-rich deposits using inkjet printing Rozenberg, Gregor G.; Bresler, Eric; Speakman, Stuart P. Applied Physics Letters, Vol. 81, Issue 27 https://doi.org/10.1063/1.1481985	journal	December 2002
Designing hybrid materials Ashby, M. F.; Bréchet, Y. J. M. Acta Materialia, Vol. 51, Issue 19, p. 5801-5821 https://doi.org/10.1016/S1359-6454(03)00441-5	journal	November 2003
Fine-line conductor manufacturing using drop-on demand PZT printing technology Szczech, J. B.; Megaridis, C. M.; Gamota, D. R. IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25, Issue 1 https://doi.org/10.1109/TEPM.2002.1000480	journal	January 2002
Direct writing of copper conductive patterns by ink-jet printing Park, Bong Kyun; Kim, Dongjo; Jeong, Sunho Thin Solid Films, Vol. 515, Issue 19 https://doi.org/10.1016/j.tsf.2006.11.142	journal	July 2007
Ink-jet printed nanoparticle microelectromechanical systems Fuller, S. B.; Wilhelm, E. J.; Jacobson, J. M. Journal of Microelectromechanical Systems, Vol. 11, Issue 1 https://doi.org/10.1109/84.982863	journal	January 2002
Capillary flow as the cause of ring stains from dried liquid drops Deegan, Robert D.; Bakajin, Olgica; Dupont, Todd F. Nature, Vol. 389, Issue 6653, p. 827-829 https://doi.org/10.1038/39827	journal	October 1997
Enhanced Aluminum Properties by Means of Precise Droplet Deposition Orme, Melissa; Smith, Robert F. Journal of Manufacturing Science and Engineering, Vol. 122, Issue 3 https://doi.org/10.1115/1.1285914	journal	September 1999
High-Resolution Inkjet Printing of All-Polymer Transistor Circuits Sirringhaus, H.; Kawase, T.; Friend, R. H. Science, Vol. 290, Issue 5499, p. 2123-2126 https://doi.org/10.1126/science.290.5499.2123	journal	December 2000
Getting Rid of the Wires: Curved Layer Fused Deposition Modeling in Conductive Polymer Additive Manufacturing Diegel, Olaf; Singamneni, Sarat; Huang, Ben Key Engineering Materials, Vol. 467-469 https://doi.org/10.4028/www.scientific.net/KEM.467-469.662	journal	February 2011
The origins and evolution of the PCB: a review Petherbridge, Kirstie; Evans, Peter; Harrison, David Circuit World, Vol. 31, Issue 1 https://doi.org/10.1108/03056120510553211	journal	March 2005
Coarsening of oxide inclusions in low alloy steel welds Babu, S. S.; David, S. A.; DebRoy, T. Science and Technology of Welding and Joining, Vol. 1, Issue 1 https://doi.org/10.1179/stw.1996.1.1.17	journal	February 1996
Inkjet printing of nanosized silver colloids Lee, Hsien-Hsueh; Chou, Kan-Sen; Huang, Kuo-Cheng Nanotechnology, Vol. 16, Issue 10 https://doi.org/10.1088/0957-4484/16/10/074	journal	September 2005
Ink-Jet Printing, Self-Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature Cheng, Kevin; Yang, Ming-Huan; Chiu, Wanda W. W. Macromolecular Rapid Communications, Vol. 26, Issue 4, p. 247-264 https://doi.org/10.1002/marc.200400462	journal	February 2005
High precision solder droplet printing technology and the state-of-the-art Liu, Qingbin; Orme, Melissa Journal of Materials Processing Technology, Vol. 115, Issue 3 https://doi.org/10.1016/S0924-0136(01)00740-3	journal	September 2001
Inkjet-printed silver conductors using silver nitrate ink and their electrical contacts with conducting polymers Liu, Zhengchun; Su, Yi; Varahramyan, Kody Thin Solid Films, Vol. 478, Issue 1-2 https://doi.org/10.1016/j.tsf.2004.11.077	journal	May 2005
Embedding electronic circuits by laser direct-write Piqué, A.; Mathews, S. A.; Pratap, B. Microelectronic Engineering, Vol. 83, Issue 11-12 https://doi.org/10.1016/j.mee.2006.06.004	journal	November 2006
Ink-jet Printing and Microwave Sintering of Conductive Silver Tracks Perelaer, J.; de Gans, B. -J.; Schubert, U. S. Advanced Materials, Vol. 18, Issue 16 https://doi.org/10.1002/adma.200502422	journal	August 2006
Novel method for room temperature sintering of Ag nanoparticle paste in air Wakuda, Daisuke; Hatamura, Mariko; Suganuma, Katsuaki Chemical Physics Letters, Vol. 441, Issue 4-6 https://doi.org/10.1016/j.cplett.2007.05.033	journal	June 2007
Review: liquid phase sintering German, Randall M.; Suri, Pavan; Park, Seong Jin Journal of Materials Science, Vol. 44, Issue 1 https://doi.org/10.1007/s10853-008-3008-0	journal	January 2009

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36 MATERIALS SCIENCE
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