Solder Interconnect Predictor (SIP) Software v. 0.5

Software · Wed Nov 19 00:00:00 EST 2008

OSTI ID:1231204

VIANCO, PAUL; NEILSEN, MICHAEL; & REJENT, JEROME

This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. The mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.

• Short Name / Acronym: SEP; 002396WKSTN00
• Version: 00
• Programming Language(s): Medium: X; OS: Unix Redhat and Windows XP Professional; Compatibility: Workstation
• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: DE-AC04-94AL85000
• OSTI ID: 1231204
• Country of Origin: United States