The MacWafer code determines maximum allowable processing temperatures and maximum heating and cooling rates for thermal processing of silicon semiconductor wafers in single and multiple wafer furnaces. The program runs interactively on Macintosh, PC, and workstation computers. Execution time is typically 20 seconds on a Macintosh 68040 processor operating at 33 MHz. Gravitational stresses and displacements are first calculated based on the user''s input of a support system consisting of a ring beneath the wafer and/or arbitrarily placed point supports. The maximum operating temperature is then deduced by comparing the calculated gravitational stresses with the temperature-dependent wafer strength. At lower temperatures, the difference between wafer strength and gravitational stress is used to determine the allowable thermal stress, and hence the allowable radial temperature difference across the wafer. Finally, an analytical model of radial heat transfer in a batch furnace yields the maximum heating or cooling rate as a function of the allowable temperature difference based on the user''s inputs of wafer spacing and furnace power. Outputs to the screen include plots of stress components and vertical displacement, as well as tables of maximum stresses and maximum heating and cooling rates as a function of temperature. All inputs and outputs may be directed to user-named files for further processing or graphical display.
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Griffiths, Stewart K., and Nilson, Robert H. Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates.
Computer software. Vers. 00. DOE/DP. 14 Jan. 1997.
Web.
Griffiths, Stewart K., & Nilson, Robert H. (1997, January 14). Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates (Version 00) [Computer software].
Griffiths, Stewart K., and Nilson, Robert H. Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates.
Computer software. Version 00. January 14, 1997.
@misc{osti_1230399,
title = {Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates, Version 00},
author = {Griffiths, Stewart K. and Nilson, Robert H.},
abstractNote = {The MacWafer code determines maximum allowable processing temperatures and maximum heating and cooling rates for thermal processing of silicon semiconductor wafers in single and multiple wafer furnaces. The program runs interactively on Macintosh, PC, and workstation computers. Execution time is typically 20 seconds on a Macintosh 68040 processor operating at 33 MHz. Gravitational stresses and displacements are first calculated based on the user''s input of a support system consisting of a ring beneath the wafer and/or arbitrarily placed point supports. The maximum operating temperature is then deduced by comparing the calculated gravitational stresses with the temperature-dependent wafer strength. At lower temperatures, the difference between wafer strength and gravitational stress is used to determine the allowable thermal stress, and hence the allowable radial temperature difference across the wafer. Finally, an analytical model of radial heat transfer in a batch furnace yields the maximum heating or cooling rate as a function of the allowable temperature difference based on the user''s inputs of wafer spacing and furnace power. Outputs to the screen include plots of stress components and vertical displacement, as well as tables of maximum stresses and maximum heating and cooling rates as a function of temperature. All inputs and outputs may be directed to user-named files for further processing or graphical display.},
doi = {},
url = {https://www.osti.gov/biblio/1230399},
year = {Tue Jan 14 00:00:00 EST 1997},
month = {Tue Jan 14 00:00:00 EST 1997},
note =
}
