3D IC for Future HEP Detectors

Journal Article · Fri Nov 07 00:00:00 EST 2014 · Journal of Instrumentation

DOI:https://doi.org/10.1088/1748-0221/9/11/C11005· OSTI ID:1228871

Thom, J. ^[1]; Lipton, R. ^[2]; Heintz, U. ^[3]; Johnson, M. ^[2]; Narain, M. ^[3]; Badman, R. ^[1]; Spiegel, L. ^[2]; Triphati, M. ^[4]; Deptuch, G. ^[2]; Kenney, C. ^[5]; Parker, S. ^[6]; Ye, Z. ^[2]; Siddons, D. ^[7]

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1. Cornell Univ., Ithaca, NY (United States)
2. Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
3. Brown Univ., Providence, RI (United States)
4. Univ. of California, Davis, CA (United States)
5. SLAC National Accelerator Lab., Menlo Park, CA (United States)
6. Univ. of Hawaii, Honolulu, HI (United States)
7. Brookhaven National Lab. (BNL), Upton, NY (United States)

Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. Here we describe ongoing R&D efforts to demonstrate functionality of components of such detectors. This also includes the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled into arrays of arbitrary size with high yield.

• Research Organization: Brookhaven National Lab. (BNL), Upton, NY (United States)
• Sponsoring Organization: USDOE Office of Science (SC), Basic Energy Sciences (BES)
• DOE Contract Number: SC00112704
• OSTI ID: 1228871
• Report Number(s): BNL-110946-2015-JA
• Journal Information: Journal of Instrumentation, Vol. 9; ISSN 1748-0221
• Publisher: Institute of Physics (IOP)
• Country of Publication: United States
• Language: English

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