Controlled cooling of an electronic system based on projected conditions

David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R.

Title: Controlled cooling of an electronic system based on projected conditions

Patent · Tue Aug 18 00:00:00 EDT 2015

OSTI ID:1210433

David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R.

Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system.

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Research Organization:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: EE0002894

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Number(s):: 9,110,476

Application Number:: 13/527,909

OSTI ID:: 1210433

Resource Relation:: Patent File Date: 2012 Jun 20

Country of Publication:: United States

Language:: English

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Cooling Medium Distribution Over A Network Of Passages Bash, Cullen E.; Patel, Chandrakant; Sharma, Ratnesh Kumar https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110112694 US Patent Application 13/000012; 20110112694	patent-application	May 2011
Hybrid Air And Liquid Coolant Conditioning Unit For Facilitating Cooling Of One Or More Electronics Racks Of A Data Center Campbell, Levi A.; Chu, Richard C.; Ellsworth, JR., Michael J. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110197612 US Patent Application 13/094247; 20110197612	patent-application	August 2011
Systems And Methods For Monitoring, Inferring State Of Health, And Optimizing Efficiency Of Refrigeration Systems Kriss, Richard https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110224947 US Patent Application 13/048698; 20110224947	patent-application	September 2011
Liquid cooled condensers for loop heat pipe like enclosure cooling Fried, Stephen Samuel; Maydanik, Yury F.; Kozhin, Vladimir A. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110277967 US Patent Application 13/068029; 2011027796	patent-application	November 2011
Interleaved, Immersion-Cooling Apparatuses And Methods For Cooling Electronic Subsystems Campbell, Levi A.; Chu, Richard C.; Ellsworth, JR., Michael J. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110315343 US Patent Application 12/825776; 20110315343	patent-application	December 2011
Interleaved, Immersion-Cooling Apparatus And Method For An Electronic Subsystem Of An Electronics Rack Campbell, Levi A.; Chu, Richard C.; Ellsworth, JR., Michael J. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110315344 US Patent Application 12/825761; 20110315344	patent-application	December 2011
Liquid-Cooled Electronics Rack With Immersion-Cooled Electronic Subsystems And Vertically-Mounted, Vapor-Condensing Unit Campbell, Levi A.; Chu, Richard C.; Ellsworth, JR, Michael J. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110315353 US Patent Application 12/825745; 20110315353	patent-application	December 2011
Immersion-Cooling Apparatus And Method For An Electronic Subsystem Of An Electronics Rack Campbell, Levi A.; Chu, Richard C.; Ellsworth, JR., Michael J. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110315355 US Patent Application 12/825756; 20110315355	patent-application	December 2011
Liquid-Cooled Electronics Rack With Immersion-Cooled Electronic Subsystems Campbell, Levi A.; Chu, Richard C.; Ellsworth, JR., Michael J. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110317367 US Patent Application 12/825781; 20110317367	patent-application	December 2011
Automatically Reconfigurable Liquid-Cooling Apparatus For An Electronics Rack Campbell, Levi A.; Chu, Richard C.; Ellsworth, JR., Michael J. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20120120603 US Patent Application 12/947302; 20120120603	patent-application	May 2012
Controlled Cooling Of An Electronic System For Reduced Energy Consumption David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20130340994 US Patent Application 13/527863; 20130340994	patent-application	December 2013
CONTROLLED COOLING OF AN ELECTRONIC SYSTEM FOR REDUCED ENERGY CONSUMPTION David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R.; https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20130340995 US Patent Application 13/775529; 20130340995	patent-application	December 2013
Controlled Cooling Of An Electronic System Based On Projected Conditions David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20130340996 US Patent Application 13/775545; 20130340996	patent-application	December 2013
Sectioned Manifolds Facilitating Pumped Immersion-Cooling Of Electronic Components Campbell, Levi A.; Chu, Richard C.; David, Milnes P. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20140123493 US Patent Application 13/788919; 20140123493	patent-application	May 2014
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Thermal performance of an integral immersion cooled multichip module package Nelson, R. D.; Sommerfeldt, S.; Bar-Cohen, A. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, Vol. 17, Issue 3, p. 405-412 https://doi.org/10.1109/95.311750	journal	January 1994
The evolution of water cooling for IBM large server systems: Back to the future Ellsworth, M. J.; Campbell, L. A.; Simons, R. E. 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM), 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems https://doi.org/10.1109/ITHERM.2008.4544279	conference	May 2008
Passive Immersion Cooling of 3-D Stacked Dies Geisler, K. J. L.; Bar-Cohen, A. IEEE Transactions on Components and Packaging Technologies, Vol. 32, Issue 3, p. 557-565 https://doi.org/10.1109/TCAPT.2008.2006186	journal	September 2009
Hybrid cooled data center using above ambient liquid cooling Rubenstein, Brandon A.; Zeighami, Roy; Lankston, Robert 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) https://doi.org/10.1109/ITHERM.2010.5501426	conference	June 2010

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