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Title: Diorganosilacetylene-alt-diorganosilvinylene polymers and a process of preparation

Patent ·
OSTI ID:119045

The present invention provides linear organosilicon polymers including acetylene and vinylene moieties, and a process for their preparation. These diorganosilacetylene-alt-diorganosilvinylene linear polymers can be represented by the formula: --[--(R{sup 1})(R{sup 2})Si--C{triple_bond}C--(R{sup 3})(R{sup 4})Si--CH{double_bond}CH--]{sub n}--, wherein n{>=}2; and each R{sup 1}, R{sup 2}, R{sup 3}, and R{sup 4} is independently selected from the group consisting of hydrogen, halogen, alkyl, alkenyl, aryl, and aralkyl radicals. The polymers are soluble in organic solvents, air stable, and can be pulled into fibers or cast into films. They can be thermally converted into silicon carbide ceramic materials.

Research Organization:
Iowa State Univ., Ames, IA (United States)
DOE Contract Number:
W-7405-ENG-82
Assignee:
Iowa State Univ. Research Foundation, Inc., Ames, IA (United States)
Patent Number(s):
US 5,457,074/A/
Application Number:
PAN: 8-202,936
OSTI ID:
119045
Resource Relation:
Other Information: PBD: 10 Oct 1995
Country of Publication:
United States
Language:
English