skip to main content

SciTech ConnectSciTech Connect

Title: RF thermal and new cold part design studies on TTF-III input coupler for Project-X

An RF power coupler is one of the key components in a superconducting (SC) linac. It provides RF power to the SC cavity and interconnects different temperature layers (1.8 K, 4.2 K, 70 K and 300 K). The TTF-III coupler is one of the most promising candidates for the High Energy (HE) linac of Project X, but it cannot meet the average power requirements because of the relatively high temperature rise on the warm inner conductor, so some design modifications will be required. In this paper, we describe our simulation studies on the copper coating thickness on the warm inner conductor with RRR values of 10 and 100. Our purpose is to rebalance the dynamic and static loads, and finally lower the temperature rise along the warm inner conductor. Additionally, to get stronger coupling, better power handling and less multipacting probability, one new cold part design was proposed using a 60 mm coaxial line; the corresponding multipacting simulation studies have also been investigated.
 [1] ;  [2] ;  [2] ;  [3] ;  [3]
  1. Chinese Academy of Sciences (CAS), Beijing (China)
  2. SLAC National Accelerator Lab., Menlo Park, CA (United States)
  3. Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Publication Date:
OSTI Identifier:
Report Number(s):
Journal ID: ISSN 1674-1137; arXiv:1108.2587
DOE Contract Number:
Resource Type:
Journal Article
Resource Relation:
Journal Name: Chinese Physics. C, High Energy Physics and Nuclear Physics; Journal Volume: 336; Journal Issue: 2
IOP Publishing
Research Org:
SLAC National Accelerator Lab., Menlo Park, CA (United States)
Sponsoring Org:
USDOE Office of Science (SC)
Country of Publication:
United States
accelerators; ACCPHY; RF thermal effect; TTF-III input coupler; multipacting; dynamic RF power loss; static thermal loss