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Title: The ThermalDiffusion class

Technical Report ·
DOI:https://doi.org/10.2172/1172794· OSTI ID:1172794
 [1]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

The ThermalDiffusion class was created to simulate one-dimensional thermal diffusion across one or more material layers. Each layer is assumed to have constant conductivity K and diffusivity κ . Interface conductance between layers may be specified. Internal heating as a function of position and time is also supported. The ThermalDiffusion class is included in the SMASH package [1] as part of the PDE (Partial Differential Equation) subpackage.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1172794
Report Number(s):
SAND2014-18790R; 540451
Country of Publication:
United States
Language:
English