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Title: Full tape thickness feature conductors for EMI structures

Patent ·
OSTI ID:1133960
; ; ;

Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
8,747,591
Application Number:
12/833,262
OSTI ID:
1133960
Country of Publication:
United States
Language:
English

References (14)

Electrical circuit using low volume multilayer transmission line devices patent June 1995
Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls patent October 1995
Antenna array for sensing signals on conductors patent August 1999
Waveguide with edge grounding patent June 2000
Miniaturized multilayer ceramic filter with high impedance lines connected to parallel coupled lines patent September 2000
Image forming apparatus having transfer drum with transfer paper charging member patent May 2001
Inductor device and process of production thereof patent March 2002
Laminated ceramic electronic components and manufacturing method therefor patent May 2004
Ceramic multilayer substrate and method for manufacturing the same patent November 2005
Method for producing a tube patent January 2007
Electronic package with improved current carrying capability and method of forming the same patent August 2008
Method of using sacrificial materials for fabricating internal cavities in laminated dielectric structures patent February 2009
Temperature compensating device with integral sheet thermistors patent-application July 2003
Paste for internal electrode and process for producing electronic part patent-application September 2006

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