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Title: Methods of manipulating stressed epistructures

Patent ·
OSTI ID:1129166

A method of processing an epistructure or processing a semiconductor device including associating a conformal and flexible handle with the epistructure and removing the epistructure and handle as a unit from the parent substrate. The method further includes causing the epistructure and handle unit to conform to a shape that differs from the shape the epistructure otherwise inherently assumes upon removal from the parent substrate. A device prepared according to the disclosed methods.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC36-08GO28308
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Number(s):
8,691,663
Application Number:
12/613,863
OSTI ID:
1129166
Resource Relation:
Patent File Date: 2009 Nov 06
Country of Publication:
United States
Language:
English

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Method of producing a complex structure by assembling stressed structures patent June 2009
Stacked-substrate processes for production of nitride semiconductor structures patent August 2009
Integrated circuit arrangement patent December 2009
Semiconductor device including a flexible support patent August 2010
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Epitaxial lift off stack having a non-uniform handle and methods thereof patent November 2012
Method and apparatus for controlling propagation of dislocations in semiconductor structures and devices patent-application January 2003
Vacuum chuck apparatus and method for holding a wafer during high pressure processing patent-application February 2005
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