SciTech Connect

Title: Heat Pipe Embedded AlSiC Plates for High Conductivity - Low CTE Heat Spreaders

Heat Pipe Embedded AlSiC Plates for High Conductivity - Low CTE Heat Spreaders Heat pipe embedded aluminum silicon carbide (AlSiC) plates are innovative heat spreaders that provide high thermal conductivity and low coefficient of thermal expansion (CTE). Since heat pipes are two phase devices, they demonstrate effective thermal conductivities ranging between 50,000 and 200,000 W/m-K, depending on the heat pipe length. Installing heat pipes into an AlSiC plate dramatically increases the plate’s effective thermal conductivity. AlSiC plates alone have a thermal conductivity of roughly 200 W/m-K and a CTE ranging from 7-12 ppm/ deg C, similar to that of silicon. An equivalent sized heat pipe embedded AlSiC plate has effective thermal conductivity ranging from 400 to 500 W/m-K and retains the CTE of AlSiC.
Authors: ; ; ;
Publication Date:
OSTI Identifier:1074137
Report Number(s):KCP-613-8705
DOE Contract Number:DE-AC04-01AL66850
Resource Type:Conference
Data Type:
Resource Relation:Conference: ITHERM 2010, IEEE, 2-5 Jun 2010, Las Vegas, Nevada (United States)
Research Org:Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org:USDOE National Nuclear Security Administration (NNSA)
Country of Publication:United States
Language:English
Subject: 42 ENGINEERING High Thermal Conductivity, Heat Spreader, Low Coefficient of Thermal Expansion (CTE), Vapor Chamber, Electronics Cooling, Heat Pipe