Effect of grain size on deformation stability of copper under quasi- static and dynamic tensile loading
The effects of grain size on the deformation stability of copper deformed in tension under quasi-static and dynamic conditions have been studied experimentally and analytically. Oxygen Free Electronic (OFE) copper samples with grain sizes of 15 {mu} and 120 {mu}m were tested. Results of the tests indicated that an increase in grain size resulted in greater extents of elongation prior to deformation instability and eventual failure under both quasi-static and dynamic loading. We have applied the deformation stability condition of Considere to both a simple power law modified to include a Hall-Petch grain size dependence and the more descriptive mechanical threshold stress (MTS) model. Calculations of the stress-strain behavior in uniaxial tension and the instability strain under quasi-static loading are compared with experiment. Both models predict an increase in the instability strain with increasing grain size, but the power law, included as a heuristic, yields a poor overall fit to both the stress-strain and the instability strains. Under dynamic loading comparison of the experimental results with analytical predictions were difficult due to inherent inaccuracy in the dynamic stress-strain data.
- Research Organization:
- Lawrence Livermore National Lab., CA (United States)
- Sponsoring Organization:
- Department of Defense, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 10142725
- Report Number(s):
- UCRL-JC-108728; CONF-911195-3; ON: DE92012677
- Resource Relation:
- Conference: Army symposium on solid mechanics: synergism of mechanics, mathematics and materials,Plymouth, MA (United States),4-7 Nov 1991; Other Information: PBD: 31 Oct 1991
- Country of Publication:
- United States
- Language:
- English
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