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Title: ECM (Environmentally Conscious Manufacturing) newsletter, August 1990. Information on environmentally conscious manufacturing processes: Volume 1, No. 1

Technical Report ·
OSTI ID:10135247

This newsletter outlines efforts to develop alternate cleaning solutions to conventional CFC and CHC based solvents for the cleaning of electrical and mechanical assemblies. Material compatibility is a primary concern. Testing results with copper substrates and Pb-Sn eutectic solder are presented. A novel sensor for monitoring the organic concentrations in copper plating baths is also described. Measurements are made in real time and the probe is small enough to be placed in the bath without disturbing the plating process. Longer intervals between bath cleanup and extended bath lifetimes will result.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
10135247
Report Number(s):
SAND-90-1375/1; ON: DE93009512
Resource Relation:
Other Information: PBD: Aug 1990
Country of Publication:
United States
Language:
English