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Title: The relevancy of current environmental issues to solder joints in microelectronic applications

Conference ·
OSTI ID:10117309
 [1];  [2]
  1. Philips Lighting Co., Somerset, NJ (United States)
  2. Sandia National Labs., Albuquerque, NM (United States)

The technical issues brought about by recent federal mandates are reviewed and discussed. Progress made in the elimination of CFCs is briefly reviewed. The problems, implications, and status of pending anti-lead legislation and taxation are discussed at length. Recommendations are made for the enactment of rational, fair, and orderly legislation and taxation.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
10117309
Report Number(s):
SAND-91-2838C; CONF-920247-5; ON: DE92006800
Resource Relation:
Conference: National electronics products conference (NEPCON) west,Anaheim, CA (United States),23-27 Feb 1992; Other Information: PBD: [1991]
Country of Publication:
United States
Language:
English