Analysis of ultrasonic tinning

Conference · Fri Nov 22 00:00:00 EST 1991

OSTI ID:10106120

Vianco, P T; Hosking, F M

This report describes experiments conducted as part of the initial phase in which the wettability of tin on oxygen-free, high conductivity (OFHC) copper was examined using a ``point source`` ultrasonic horn.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 10106120
• Report Number(s): SAND-91-2661C; CONF-920247-2; ON: DE92003948
• Resource Relation: Conference: National electronics products conference (NEPCON) west,Anaheim, CA (United States),23-27 Feb 1992; Other Information: PBD: 22 Nov 1991
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER
SOLDERING
TIN
WETTABILITY
ULTRASONIC WAVES
EROSION
SOLVENTS
360101
PREPARATION AND FABRICATION