Tin-silver-bismuth solders for electronics assembly
Patent
·
OSTI ID:101003
A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218 C down to about 205 C depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10 C/min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight). 4 figs.
- Research Organization:
- AT&T
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- Sandia Corp., Albuquerque, NM (United States)
- Patent Number(s):
- US 5,439,639/A/
- Application Number:
- PAN: 8-177,504
- OSTI ID:
- 101003
- Resource Relation:
- Other Information: PBD: 8 Aug 1995
- Country of Publication:
- United States
- Language:
- English
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